["Circuits and DevicesBasic principles and practical applications of analogue and digital circuitsSemiconductor Technology IBasic principles of fabrication and miniaturisation of semiconductor devices and circuitsMicrosystems and Sensor TechnologyAnalytical view as well as practical hands-on perspective on MEMS fabrication processes and overview of microsensorsPackaging in Microelectronics IBasic principles of electronic device assembly as well as circuit board and interposer fabricationOperations and Logistics Management IBasic understanding of the different logistic subsystems, historical development, characteristics, aims and objectives as well as future logistic trendsInvestment and FinancingBasic principles of investment planning and investment decisions as well as basic understanding of uncertainty, risk, corporate financing, cash and credit managementSemiconductor Technology IIIn-depth understanding of thermal processes, lithography and the interaction between physical fundamentals and function principlesPackaging in Microelectronics IIApplying the knowledge of basic principles to microelectronic devices, printed circuit boards and electronic systemsProject ManagementAnalytical view as well as strategic and practical hands-on perspective on operations and business processesOperations and Logistics Management IIIn-depth understanding of different concepts to optimise logistic processes and models to calculate production and order lot sizes"]
All applicants
14 Aug 2026